- 专利标题: OPTOISOLATOR LEADFRAME ASSEMBLY
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申请号: US13783698申请日: 2013-03-04
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公开(公告)号: US20130175679A1公开(公告)日: 2013-07-11
- 发明人: CHENG-HONG SU , CHIH-HUNG TZENG
- 申请人: CHENG-HONG SU , CHIH-HUNG TZENG
- 优先权: CN200710032617.1 20071213
- 主分类号: H01L23/495
- IPC分类号: H01L23/495
摘要:
An optoisolator leadframe assembly includes: an emitter leadframe part including a first rail and a plurality of emitter leadframe units, each rail including two rows of emitter leadframes, each having a die-mounting pad; and a receiver leadframe part including a second rail and a plurality of receiver leadframe units, each including two rows of receiver leadframes, each having a die-mounting pad. The die-mounting pads of the emitter leadframes of each row of each of the emitter leadframe units are respectively aligned with and spaced apart from the die-mounting pads of the receiver leadframes of an adjacent row of an adjacent one of the receiver leadframe units. Each of the emitter and receiver leadframe parts is a single piece.
公开/授权文献
- US08853837B2 Optoisolator leadframe assembly 公开/授权日:2014-10-07
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