Invention Application
- Patent Title: Heat Shrink Wire Marker Carrier
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Application No.: US13717832Application Date: 2012-12-18
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Publication No.: US20130177725A1Publication Date: 2013-07-11
- Inventor: Shawn E. Whittaker , David Scott Morrison
- Applicant: Panduit Corp.
- Applicant Address: US IL Tinley Park
- Assignee: PANDUIT CORP.
- Current Assignee: PANDUIT CORP.
- Current Assignee Address: US IL Tinley Park
- Main IPC: B42D15/00
- IPC: B42D15/00 ; B32B3/26

Abstract:
A wire marker is provided. A carrier strip includes a first layer having at least one opening, two bands applied to opposite edges of the first layer, the bands including an adhesive on at least one side, and a label secured into the opening and attached to the adhesive. At least one access perforation may be located on the first layer that is horizontal and adjacent to one side of the opening. The access perforation facilitates removal of the label from the carrier and allows for insertion of a cable through the label. A plurality of horizontal carrier perforations may further be located between each opening on the first layer to facilitate removal of the carrier strip from a printer.
Public/Granted literature
- US08592019B2 Heat shrink wire marker carrier Public/Granted day:2013-11-26
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