发明申请
- 专利标题: MOISTURE-PROOF INSULATING MATERIAL
- 专利标题(中): 防潮保温材料
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申请号: US13824253申请日: 2011-10-17
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公开(公告)号: US20130178578A1公开(公告)日: 2013-07-11
- 发明人: Kazuhiko Ooga , Ritsuko Azuma
- 申请人: Kazuhiko Ooga , Ritsuko Azuma
- 申请人地址: JP Minato-ku, Tokyo
- 专利权人: SHOWA DENKO K.K.
- 当前专利权人: SHOWA DENKO K.K.
- 当前专利权人地址: JP Minato-ku, Tokyo
- 优先权: JP2010-237476 20101022
- 国际申请: PCT/JP2011/073846 WO 20111017
- 主分类号: H01B7/28
- IPC分类号: H01B7/28
摘要:
Provided are: a moisture-proof insulating material having superior long-term insulating reliability and adhesiveness to polyimides and glass substrates, and has a solid content concentration that can secure a thickness that realizes sufficient moisture-proof performance after application and drying in a viscosity region that can be easily coated by means of a dispenser; and an electronic component that has been insulation-processed by means of the moisture-proof insulating material. The moisture-proof insulating material contains a styrene-based thermoplastic elastomer, a tackifying agent, and a solvent, and is characterized by the solvent containing an aliphatic hydrocarbon solvent (for example, methylcyclohexane or cyclohexane) having a boiling point that is at least 80° C. and less than 110° C. The solvent preferably further contains an aliphatic hydrocarbon solvent (for example, ethylcyclohexane or dimethylcyclohexane) having a boiling point that is at least 110° C. and less than 140° C.
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