发明申请
- 专利标题： METHOD OF MANUFACTURING PLATE-SHAPED BONDED BODY, BONDING DEVICE, AND PLATE-SHAPED BONDED BODY
- 专利标题（中）： 制造板形结合体，结合装置和板形结合体的方法
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申请号： US13824828申请日： 2011-12-19
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公开(公告)号： US20130183530A1公开(公告)日： 2013-07-18
- 发明人: Kouichi Ogawa , Yoshihisa Shinya , Tomoyuki Toyoda , Yasumi Endo
- 申请人： Kouichi Ogawa , Yoshihisa Shinya , Tomoyuki Toyoda , Yasumi Endo
- 申请人地址： JP Tokyo
- 专利权人： DEXERIALS CORPORATION
- 当前专利权人： DEXERIALS CORPORATION
- 当前专利权人地址： JP Tokyo
- 优先权： JP2010-285690 20101222
- 国际申请： PCT/JP11/79371 WO 20111219
- 主分类号： B29C43/28
- IPC分类号： B29C43/28 ; B32B7/12 ; B32B17/00
摘要：
A method for quickly applying and spreading adhesive between substrates without leaving air bubbles. The method includes holding two substrates apart from each other with adhesive sides facing, a second substrate being positioned above a first substrate. The second substrate is suspended in a manner so as to cause a portion to warp towards the first substrate. After a liquid filler is applied between the two substrates, rollers are lowered onto the second substrate and moved so as to disperse the liquid filler between the first and second substrates. In accordance with the rolling of the rollers, end portions of the second substrate are lowered towards the first substrate.
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