发明申请
- 专利标题： PACKAGE ASSEMBLY AND METHOD OF FORMING THE SAME
- 专利标题（中）： 包装装配及其形成方法
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申请号： US13427787申请日： 2012-03-22
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公开(公告)号： US20130187269A1公开(公告)日： 2013-07-25
- 发明人: Hung-Jen LIN , Tsung-Ding WANG , Chien-Hsiun LEE , Wen-Hsiung LU , Ming-Da CHENG , Chung-Shi LIU
- 申请人： Hung-Jen LIN , Tsung-Ding WANG , Chien-Hsiun LEE , Wen-Hsiung LU , Ming-Da CHENG , Chung-Shi LIU
- 申请人地址： TW Hsinchu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW Hsinchu
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/56
摘要：
A package assembly including a semiconductor die electrically coupled to a substrate by an interconnected joint structure. The semiconductor die includes a bump overlying a semiconductor substrate, and a molding compound layer overlying the semiconductor substrate and being in physical contact with a first portion of the bump. The substrate includes a no-flow underfill layer on a conductive region. A second portion of the bump is in physical contact with the no-flow underfill layer to form the interconnected joint structure.
公开/授权文献
- US09059109B2 Package assembly and method of forming the same 公开/授权日：2015-06-16
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