发明申请
US20130192794A1 INTERCHANGEABLE COOLING SYSTEM FOR INTEGRATED CIRCUIT AND CIRCUIT BOARD
审中-公开
用于集成电路和电路板的可互换冷却系统
- 专利标题： INTERCHANGEABLE COOLING SYSTEM FOR INTEGRATED CIRCUIT AND CIRCUIT BOARD
- 专利标题（中）： 用于集成电路和电路板的可互换冷却系统
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申请号： US13361929申请日： 2012-01-30
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公开(公告)号： US20130192794A1公开(公告)日： 2013-08-01
- 发明人: Timothy J. Chainer , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
- 申请人： Timothy J. Chainer , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 主分类号： F28F9/00
- IPC分类号： F28F9/00
摘要：
Several apparatuses and methods for providing cooling system interchangeability. One apparatus includes a thermally conductive plate thermally coupled to an integrated circuit. The thermally conductive plate is configured to couple interchangeably to a liquid cooling assembly or an air cooling assembly, and the liquid cooling assembly and the air cooling assembly are separate devices.