Invention Application
US20130197338A1 PAIN SIGNAL MEASUREMENT DEVICE AND PAIN SIGNAL MEASURING AND CONTROLLING METHOD THEREOF
审中-公开
PAIN信号测量装置和PAIN信号测量及其控制方法
- Patent Title: PAIN SIGNAL MEASUREMENT DEVICE AND PAIN SIGNAL MEASURING AND CONTROLLING METHOD THEREOF
- Patent Title (中): PAIN信号测量装置和PAIN信号测量及其控制方法
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Application No.: US13744324Application Date: 2013-01-17
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Publication No.: US20130197338A1Publication Date: 2013-08-01
- Inventor: Han Young YU , Yark Yeon KIM , Yong Ju YUN , Won Ick JANG
- Applicant: Electronics and Telecommunications Research Institute
- Applicant Address: KR Daejeon
- Assignee: Electronics and Telecommunications Research Institute
- Current Assignee: Electronics and Telecommunications Research Institute
- Current Assignee Address: KR Daejeon
- Priority: KR10-2012-0009018 20120130; KR10-2012-0099448 20120907
- Main IPC: A61N1/36
- IPC: A61N1/36 ; A61B5/04

Abstract:
Provided is a pain signal measurement device including a microprobe array inserted into a skin to measure a pain signal. The microprobe array includes a guard electrode disposed on a substrate; a plurality of microprobes penetrating the substrate and the guard electrode, electrically insulated from the guard electrode, and measuring a voltage or current of the skin into which the microprobe array is inserted; and an insulating layer disposed between the guard electrode and a guarded electrode of each of the microprobes to reduce a noise between the microprobes. A surface of the insulating layer of each of the microprobes is grounded to the guard electrode.
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