- 专利标题： SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
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申请号： US13614125申请日： 2012-09-13
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公开(公告)号： US20130200514A1公开(公告)日： 2013-08-08
- 发明人: Doojin Kim , Youngsik Kim , Kitaik OH , Sungbok Hong
- 申请人： Doojin Kim , Youngsik Kim , Kitaik OH , Sungbok Hong
- 申请人地址： KR Suwon-si
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Suwon-si
- 优先权： KR10-2012-0012926 20120208
- 主分类号： H01L23/498
- IPC分类号： H01L23/498
摘要：
A semiconductor package comprises a board including a board pad, a plurality of semiconductor chips mounted on the board, the semiconductor chips including chip pads. Bumps are disposed on the chip pads, respectively, and a wire is disposed between the chip pads and the bumps. The wire electrically connects the chip pads of the plurality of semiconductor chips and the board pad to each other.
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