发明申请
- 专利标题: THERMISTOR
- 专利标题(中): 温控器
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申请号: US13365726申请日: 2012-02-03
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公开(公告)号: US20130200987A1公开(公告)日: 2013-08-08
- 发明人: Yi An SHA , Chun Teng TSENG , David Shau Chew WANG
- 申请人: Yi An SHA , Chun Teng TSENG , David Shau Chew WANG
- 申请人地址: TW Hsinchu
- 专利权人: POLYTRONICS TECHNOLOGY CORP.
- 当前专利权人: POLYTRONICS TECHNOLOGY CORP.
- 当前专利权人地址: TW Hsinchu
- 主分类号: H01C7/02
- IPC分类号: H01C7/02
摘要:
A thermistor includes a resistive device, a first insulation layer, a first electrode, a second electrode and a first heat-conductive layer. The resistive device includes a first electrically conductive member, a second electrically conductive member and a polymeric material layer laminated therebetween. The polymeric material layer exhibits positive temperature coefficient (PTC) or negative temperature coefficient (NTC) behavior. The first insulation layer is disposed on the first electrically conductive member. The first electrode is electrically coupled to the first electrically conductive member, whereas the second electrode is electrically coupled to the second electrically conductive member and is insulated from the first electrode. The first heat-conductive layer is disposed on the first insulation layer, and has a heat conductivity of at least 30 W/m-K and a thickness of 15-250 μm.
公开/授权文献
- US08502638B1 Thermistor 公开/授权日:2013-08-06
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