发明申请
- 专利标题: LIQUID EJECTION HEAD AND METHOD OF MANUFACTURING THE SAME
- 专利标题(中): 液体喷射头及其制造方法
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申请号: US13749346申请日: 2013-01-24
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公开(公告)号: US20130201249A1公开(公告)日: 2013-08-08
- 发明人: Yoshihiro Hamada , Tadayoshi Inamoto , Isao Imamura , Hiroki Kihara
- 申请人: Yoshihiro Hamada , Tadayoshi Inamoto , Isao Imamura , Hiroki Kihara
- 申请人地址: JP Tokyo
- 专利权人: CANON KABUSHIKI KAISHA
- 当前专利权人: CANON KABUSHIKI KAISHA
- 当前专利权人地址: JP Tokyo
- 优先权: JP2012-022995 20120206
- 主分类号: B41J2/01
- IPC分类号: B41J2/01 ; H01L21/02
摘要:
A liquid ejection head includes: a chip including a substrate having an energy generating element, an ejection orifice member, and an electrode terminal; an electric wiring board; a support member for supporting the wiring board, the support member having an opening surrounding the chip; a chip periphery sealing member which fills a gap between the chip and the opening; and an electrically connecting portion sealing member disposed in contact with the chip periphery sealing member and which covers an electrically connecting portion between the chip and the electric wiring board. The electrically connecting portion sealing member is a cured product of a material containing filler. The chip periphery sealing member is a cured product of a material containing at least one of specific siloxanes. The chip periphery sealing member and the electrically connecting portion sealing member has a difference in coefficient of linear expansion of 50 ppm/° C. or more.
公开/授权文献
- US08833901B2 Liquid ejection head and method of manufacturing the same 公开/授权日:2014-09-16
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