Invention Application
- Patent Title: IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
- Patent Title (中): 图像传感器及其制作方法
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Application No.: US13837356Application Date: 2013-03-15
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Publication No.: US20130203209A1Publication Date: 2013-08-08
- Inventor: Byung Jun PARK , Yong Woo LEE , Chang Rok MOON
- Applicant: Byung Jun PARK , Yong Woo LEE , Chang Rok MOON
- Priority: KR10-2009-0012516 20090216; KR10-2009-0016948 20090227
- Main IPC: H01L31/18
- IPC: H01L31/18

Abstract:
The image sensor includes a substrate, an insulating structure formed on a first surface of the substrate and including a first metal wiring layer exposed by a contact hole penetrating the substrate, a conductive spacer formed on sidewalls of the contact hole and electrically connected to the first metal wiring layer, and a pad formed on a second surface of the substrate and electrically connected to the first metal wiring layer.
Public/Granted literature
- US08736009B2 Image sensor and method of fabricating the same Public/Granted day:2014-05-27
Information query
IPC分类: