发明申请
- 专利标题: THROUGH-SUBSTRATE OPTICAL COUPLING TO PHOTONICS CHIPS
- 专利标题(中): 通过光电耦合到光电晶体管
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申请号: US13370886申请日: 2012-02-10
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公开(公告)号: US20130209026A1公开(公告)日: 2013-08-15
- 发明人: Fuad Doany , Benjamin G. Lee , Clint L. Schow
- 申请人: Fuad Doany , Benjamin G. Lee , Clint L. Schow
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 主分类号: G02B6/12
- IPC分类号: G02B6/12 ; H01L33/58
摘要:
An optoelectronic integrated circuit for coupling light to or from an optical waveguide formed in an optical device layer in a near-normal angle to that layer. In an embodiment, the integrated circuit comprises a semiconductor body including a metal-dielectric stack, an optical device layer, a buried oxide layer and a semiconductor substrate arranged in series between first and second opposite sides of the semiconductor body. At least one optical waveguide is formed in the optical device layer for guiding light in a defined plane in that device layer. Diffractive coupling elements are disposed in the optical device layer to couple light from the waveguide toward the second surface of the semiconductor body at a near-normal angle to the defined plane in the optical device layer. In an embodiment, an optical fiber is positioned against the semiconductor body for receiving the light from the coupling elements.
公开/授权文献
- US09285554B2 Through-substrate optical coupling to photonics chips 公开/授权日:2016-03-15
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