发明申请
- 专利标题： MODULAR GRINDING APPARATUSES AND METHODS FOR WAFER THINNING
- 专利标题（中）： 模块化研磨设备及其减薄方法
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申请号： US13370946申请日： 2012-02-10
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公开(公告)号： US20130210321A1公开(公告)日： 2013-08-15
- 发明人: Chun-Ting KUO , Kei-Wei CHEN , Ying-Lang WANG , Kuo-Hsiu WEI
- 申请人： Chun-Ting KUO , Kei-Wei CHEN , Ying-Lang WANG , Kuo-Hsiu WEI
- 申请人地址： TW Hsinchu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW Hsinchu
- 主分类号： H01L21/02
- IPC分类号： H01L21/02 ; B24B7/00
摘要：
Methods of thinning a plurality of semiconductor wafers and apparatuses for carrying out the same are disclosed. A grinding module within a set of grinding modules receives and grinds a semiconductor wafer. A polishing module receives the semiconductor wafer from the grinding module and polishes the wafer. The polishing module is configured to polish the semiconductor wafer in less time than the grinding module is configured to grind the corresponding wafer.
公开/授权文献
- US09570311B2 Modular grinding apparatuses and methods for wafer thinning 公开/授权日：2017-02-14
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