发明申请
US20130214107A1 MELT-BONDABLE PANEL MOUNTING BRACKETS, SYSTEMS, AND METHODS
审中-公开
MELT-BONDABLE面板安装支架,系统和方法
- 专利标题: MELT-BONDABLE PANEL MOUNTING BRACKETS, SYSTEMS, AND METHODS
- 专利标题(中): MELT-BONDABLE面板安装支架,系统和方法
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申请号: US13850642申请日: 2013-03-26
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公开(公告)号: US20130214107A1公开(公告)日: 2013-08-22
- 发明人: Brian Hillstrom , A. Chase Norton , Bryan K. Harris
- 申请人: Brian Hillstrom , A. Chase Norton , Bryan K. Harris
- 申请人地址: US UT Salt Lake City
- 专利权人: 3FORM, INC.
- 当前专利权人: 3FORM, INC.
- 当前专利权人地址: US UT Salt Lake City
- 主分类号: F16M13/02
- IPC分类号: F16M13/02
摘要:
Panel mounting components and systems for mounting objects, such as decorative architectural resin panels, can include a melt-bondable panel mounting bracket. Melt-bondable panel mounting brackets can include one or more bonding features configured to be pressed or rotated into a resin-based panel, thereby allowing additional components, such as a twist-lock mounting assembly, to be secured directly to a single side of a panel. Methods of securing melt-bondable panel mounting brackets to a resin panel can include rotating the melt-bondable panel mounting brackets at high speeds of rotation to cause a portion of the resin panel to melt and bond about the melt-bondable panel mounting brackets.
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