发明申请
US20130215613A1 LED PACKAGING STRUCTURE HAVING IMPROVED THERMAL DISSIPATION AND MECHANICAL STRENGTH
有权
具有改进的热释放和机械强度的LED包装结构
- 专利标题： LED PACKAGING STRUCTURE HAVING IMPROVED THERMAL DISSIPATION AND MECHANICAL STRENGTH
- 专利标题（中）： 具有改进的热释放和机械强度的LED包装结构
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申请号： US13399027申请日： 2012-02-17
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公开(公告)号： US20130215613A1公开(公告)日： 2013-08-22
- 发明人: Yi-Tsuo Wu
- 申请人： Yi-Tsuo Wu
- 申请人地址： TW HsinChu
- 专利权人： TSMC Solid State Lighting Ltd.
- 当前专利权人： TSMC Solid State Lighting Ltd.
- 当前专利权人地址： TW HsinChu
- 主分类号： F21V29/00
- IPC分类号： F21V29/00 ; F21V17/12 ; F21V25/00 ; F21V21/00
摘要：
The present disclosure involves a lighting apparatus. The lighting apparatus includes a thermally-conductive substrate. The thermally-conductive substrate may include a substrate. The lighting apparatus also includes a printed circuit board (PCB). The PCB is located besides the thermally-conductive substrate. The PCB and the thermally-conductive substrate have different material compositions. The lighting apparatus also includes a photonic device located over the thermally-conductive substrate. The photonic device may include a light-emitting diode (LED) die. The photonic device is thermally coupled to the thermally-conductive substrate. The photonic device is electrically coupled to the printed circuit board. The lighting apparatus also includes a thermal dissipation structure. The thermal dissipation structure is thermally coupled to the thermally-conductive substrate.
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