发明申请
- 专利标题： Moldable Earpiece System
- 专利标题（中）： 可模塑耳塞系统
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申请号： US13761947申请日： 2013-02-07
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公开(公告)号： US20130216086A1公开(公告)日： 2013-08-22
- 发明人: Kyle J Kirkpatrick
- 申请人： Decibullz LLC
- 申请人地址： US CO Loveland
- 专利权人： Decibullz LLC
- 当前专利权人： Decibullz LLC
- 当前专利权人地址： US CO Loveland
- 主分类号： H04R1/10
- IPC分类号： H04R1/10
摘要：
An earpiece including an external surface having a first fixed configuration disposable within the outer ear and having a passage adapted for retention of an in ear device, the earpiece heatable to achieve a moldable condition which allows reconfiguration of the external surface by engagement with the outer ear to dispose the external surface in a second fixed configuration in greater conformity to the outer ear.
公开/授权文献
- US09451353B2 Moldable earpiece system 公开/授权日：2016-09-20