发明申请
- 专利标题： WAFER EDGE TRIM BLADE WITH SLOTS
- 专利标题（中）： WAFER EDGE TRIM刀片与SLOTS
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申请号： US13408327申请日： 2012-02-29
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公开(公告)号： US20130220090A1公开(公告)日： 2013-08-29
- 发明人: Chun-Ting KUO , Kei-Wei CHEN , Ying-Lang WANG , Kuo-Hsiu WEI
- 申请人： Chun-Ting KUO , Kei-Wei CHEN , Ying-Lang WANG , Kuo-Hsiu WEI
- 申请人地址： TW Hsinchu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW Hsinchu
- 主分类号： B26D1/14
- IPC分类号： B26D1/14 ; B26D7/18 ; B24D3/00
摘要：
A wafer edge trim blade includes a round blade body and at least one slot formed inward from an outside edge of the round blade body. The at least one slot is configured to remove debris generated during wafer edge trimming using the wafer edge trim blade.
公开/授权文献
- US09676114B2 Wafer edge trim blade with slots 公开/授权日：2017-06-13