发明申请
US20130220681A1 RESIN COMPOSITION FOR FORMING RECEIVING LAYER, AND RECEIVING SUBSTRATE; PRINTED MATTER, CONDUCTIVE PATTERN, AND ELECTRIC CIRCUIT PRODUCED BY USING THE RESIN COMPOSITION
审中-公开
形成接收层的树脂组合物和接收基材; 印刷材料，导电图案和使用树脂组合物生产的电路
- 专利标题： RESIN COMPOSITION FOR FORMING RECEIVING LAYER, AND RECEIVING SUBSTRATE; PRINTED MATTER, CONDUCTIVE PATTERN, AND ELECTRIC CIRCUIT PRODUCED BY USING THE RESIN COMPOSITION
- 专利标题（中）： 形成接收层的树脂组合物和接收基材; 印刷材料，导电图案和使用树脂组合物生产的电路
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申请号： US13881332申请日： 2012-09-10
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公开(公告)号： US20130220681A1公开(公告)日： 2013-08-29
- 发明人: Yukie Saitou , Wataru Fujikawa , Jun Shirakami
- 申请人： Yukie Saitou , Wataru Fujikawa , Jun Shirakami
- 申请人地址： JP Tokyo
- 专利权人： DIC Corporation
- 当前专利权人： DIC Corporation
- 当前专利权人地址： JP Tokyo
- 优先权： JP2011-216924 20110930
- 国际申请： PCT/JP2012/073043 WO 20120910
- 主分类号： B41M5/52
- IPC分类号： B41M5/52 ; C08L33/12 ; H05K3/12 ; H05K1/03
摘要：
The present invention provides a resin composition for forming receiving layers that can form a receiving layer having excellent adhesiveness, has a fine-line-forming property and water resistance even when any of a water-based conductive ink and a solvent-based conductive ink is used, and can form a conductive pattern or the like having wet-heat resistance.The present invention relates to a resin composition for forming receiving layers that includes a vinyl resin (A) having a weight-average molecular weight of 100,000 or more and an acid value of 10 to 80, a water-based medium (B), and, optionally, at least one component (C) selected from the group consisting of a water-soluble resin (c1) and a filler (c2), wherein the vinyl resin (A) is dispersed in the water-based medium (B) and content of the component (C) is 0% by mass to 15% by mass relative to the total amount of the vinyl resin (A).
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