发明申请
- 专利标题: SILICON CARBIDE SUBSTRATE AND SEMICONDUCTOR DEVICE
- 专利标题(中): 碳化硅基板和半导体器件
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申请号: US13885573申请日: 2011-11-15
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公开(公告)号: US20130228797A1公开(公告)日: 2013-09-05
- 发明人: Hiroyuki Nagasawa , Takamitsu Kawahara , Kuniaki Yagi , Naoki Hatta
- 申请人: Hiroyuki Nagasawa , Takamitsu Kawahara , Kuniaki Yagi , Naoki Hatta
- 申请人地址: JP Tokyo
- 专利权人: HOYA CORPORATION
- 当前专利权人: HOYA CORPORATION
- 当前专利权人地址: JP Tokyo
- 优先权: JP2010-254530 20101115; JP2011-197579 20110909
- 国际申请: PCT/JP2011/076226 WO 20111115
- 主分类号: H01L29/16
- IPC分类号: H01L29/16
摘要:
To provide a silicon carbide substrate having at least one or more main surfaces, including: a plurality of encapsulated regions inside, wherein the plurality of encapsulated regions are distributed in a direction approximately parallel to one of the main surfaces, with each encapsulated region positioned at a distance of 100 nm or more and 100 μm or less from the main surfaces to inside a substrate, and each encapsulated region having a width of 100 nm or more and 100 μm or less in a direction parallel to the main surfaces.
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