发明申请
US20130228797A1 SILICON CARBIDE SUBSTRATE AND SEMICONDUCTOR DEVICE 审中-公开
碳化硅基板和半导体器件

SILICON CARBIDE SUBSTRATE AND SEMICONDUCTOR DEVICE
摘要:
To provide a silicon carbide substrate having at least one or more main surfaces, including: a plurality of encapsulated regions inside, wherein the plurality of encapsulated regions are distributed in a direction approximately parallel to one of the main surfaces, with each encapsulated region positioned at a distance of 100 nm or more and 100 μm or less from the main surfaces to inside a substrate, and each encapsulated region having a width of 100 nm or more and 100 μm or less in a direction parallel to the main surfaces.
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