Invention Application
US20130229776A1 HIGH-SPEED, FLEXIBLE INTEGRATED CIRCUITS AND METHODS FOR MAKING HIGH-SPEED, FLEXIBLE INTEGRATED CIRCUITS
审中-公开
高速，灵活的集成电路和制造高速，灵活的集成电路的方法
- Patent Title: HIGH-SPEED, FLEXIBLE INTEGRATED CIRCUITS AND METHODS FOR MAKING HIGH-SPEED, FLEXIBLE INTEGRATED CIRCUITS
- Patent Title (中): 高速，灵活的集成电路和制造高速，灵活的集成电路的方法
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Application No.: US13724051Application Date: 2012-12-21
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Publication No.: US20130229776A1Publication Date: 2013-09-05
- Inventor: Zhenqiang Ma , Guoxuan Qin , Namki Cho
- Applicant: WISCONSIN ALUMNI RESEARCH FOUNDATION
- Applicant Address: US WI Madison
- Assignee: Wisconsin Alumni Research Foundation
- Current Assignee: Wisconsin Alumni Research Foundation
- Current Assignee Address: US WI Madison
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/28
Abstract:
The present invention provides flexible devices, such as integrated circuits, having a multilevel electronic device structure including two or more electronic components. The electronic components within the structure are electrically connected by an interconnect structure having multiple interconnect levels. In addition to the multilevel electronic device structure, the flexible devices include an elastomeric material disposed around the interconnect levels, including within the spaces between the interconnect levels.
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