发明申请
- 专利标题: Physical Unclonable Interconnect Function Array
- 专利标题(中): 物理不可克隆互连功能阵列
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申请号: US13414825申请日: 2012-03-08
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公开(公告)号: US20130233608A1公开(公告)日: 2013-09-12
- 发明人: Kai D. Feng , Wai-Kin Li , Ping-Chuan Wang , Zhijian Yang
- 申请人: Kai D. Feng , Wai-Kin Li , Ping-Chuan Wang , Zhijian Yang
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 主分类号: H05K1/11
- IPC分类号: H05K1/11 ; B05D5/12 ; B05D5/00
摘要:
A method for fabricating an interconnect function array includes forming a first plurality of conductive lines on a substrate, forming an insulator layer over the first plurality of conductive lines and the substrate, removing portions of the insulator layer to define cavities in the insulator layer that expose portions of the substrate and the first plurality of conductive lines, wherein the removal of the portions of the insulator layer results in a substantially random arrangement of cavities exposing portions of the substrate and the first plurality of conductive lines, depositing a conductive material in the cavities, and forming a second plurality of conductive lines on portions of the conductive material in the cavities and the insulator layer.