发明申请
- 专利标题： Wire Bonding Structures for Integrated Circuits
- 专利标题（中）： 集成电路引线接合结构
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申请号： US13422306申请日： 2012-03-16
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公开(公告)号： US20130241058A1公开(公告)日： 2013-09-19
- 发明人: Chen-Hua Yu , Mirng-Ji Lii , Chien-Hsiun Lee , Yung Ching Chen
- 申请人： Chen-Hua Yu , Mirng-Ji Lii , Chien-Hsiun Lee , Yung Ching Chen
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A device includes a substrate, and a bond pad over the substrate. A protection layer is disposed over the bond pad. The protection layer and the bond pad include different materials. A bond ball is disposed onto the protection layer. A bond wire is joined to the bond ball.
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