发明申请
- 专利标题: METHOD FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE
- 专利标题(中): 制造碳化硅半导体器件的方法
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申请号: US13884166申请日: 2011-09-09
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公开(公告)号: US20130244428A1公开(公告)日: 2013-09-19
- 发明人: Jun-ichi Ohno
- 申请人: Jun-ichi Ohno
- 优先权: JP2011-086984 20110411
- 国际申请: PCT/JP2011/070590 WO 20110909
- 主分类号: H01L21/3065
- IPC分类号: H01L21/3065
摘要:
In a method for manufacturing a silicon carbide semiconductor device, a conductive layer is formed on a silicon carbide layer. The silicon carbide layer and the conductive layer react with each other thus forming an alloy layer formed of a reaction layer in contact with the silicon carbide layer and a silicide layer on the reaction layer. A carbon component is removed from the silicide layer. A portion of the silicide layer is removed using an acid thus exposing at least a portion of the reaction layer. An electrode layer is formed on an upper side of the exposed reaction layer.
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