A flexible print circuit bonding structure of an electronic device is provided. The electronic device has a viewing area, a tracing area and a bonding area, wherein the tracing area is disposed between the viewing area and the bonding area. The flexible print circuit bonding structure includes a substrate. A transparent conductive layer is disposed on the substrate and extends from the tracing area to the bonding area. A metal trace layer is disposed on the transparent conductive layer at the tracing area, but does not extend to the bonding area. An anisotropic conductive film is disposed on the transparent conductive layer at the bonding area and directly contacts the transparent conductive layer. Then, a flexible print circuit is bonded to the anisotropic conductive film.