发明申请
- 专利标题： PRINTED CIRCUIT BOARD
- 专利标题（中）： 印刷电路板
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申请号： US13569195申请日： 2012-08-08
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公开(公告)号： US20130248237A1公开(公告)日： 2013-09-26
- 发明人: JIE-SONG ZHOU , XING-HUA TANG
- 申请人： JIE-SONG ZHOU , XING-HUA TANG
- 申请人地址： TW Tu-Cheng CN Shenzhen City
- 专利权人： HON HAI PRECISION INDUSTRY CO., LTD.,HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD .
- 当前专利权人： HON HAI PRECISION INDUSTRY CO., LTD.,HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD .
- 当前专利权人地址： TW Tu-Cheng CN Shenzhen City
- 优先权： CN201210075382.5 20120321
- 主分类号： H05K1/11
- IPC分类号： H05K1/11
摘要：
A printed circuit board (PCB) includes at least two vias and at least two bonding pads corresponding to the vias. Each bonding pad is arranged on the surface of the PCB around the corresponding one of the at least two vias. Between two adjacent bonding pads, a through hole is arranged for preventing molten solder overflowing from one bonding pad to the other.
信息查询
