Invention Application
- Patent Title: INTEGRATED CIRCUIT PACKAGE HAVING A SPLIT LEAD FRAME
- Patent Title (中): 具有分离引线框架的集成电路封装
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Application No.: US13749776Application Date: 2013-01-25
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Publication No.: US20130249546A1Publication Date: 2013-09-26
- Inventor: Paul David , William P. Taylor , P. Karl Scheller , Ravi Vig , Andreas P. Friedrich
- Applicant: ALLEGRO MICROSYSTEMS, LLC
- Applicant Address: US MA Worcester
- Assignee: Allegro Microsystems, LLC
- Current Assignee: Allegro Microsystems, LLC
- Current Assignee Address: US MA Worcester
- Main IPC: G01R33/00
- IPC: G01R33/00
Abstract:
A magnetic field sensor includes a lead frame having a plurality of leads, at least two of which have a connection portion and a die attach portion. A semiconductor die is attached to the die attach portion of the at least two leads. In some embodiments, at least one passive component is attached to the die attach portion of at least two leads.
Public/Granted literature
- US09494660B2 Integrated circuit package having a split lead frame Public/Granted day:2016-11-15
Information query
