Invention Application
- Patent Title: ELECTRONIC COMPONENT
- Patent Title (中): 电子元件
-
Application No.: US13899697Application Date: 2013-05-22
-
Publication No.: US20130250474A1Publication Date: 2013-09-26
- Inventor: Syunsuke TAKEUCHI , Yoji YAMAMOTO , Akihiro MOTOKI , Makoto OGAWA , Masahito SARUBAN
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo-shi
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo-shi
- Priority: JP2010-075397 20100329
- Main IPC: H01G4/30
- IPC: H01G4/30
Abstract:
An electronic component includes a laminate including a plurality of insulating layers that are laminated on each other. A capacitor conductor is embedded in the laminate and includes an exposed portion exposed between the insulating layers at a predetermined surface of the laminate. An external electrode is provided on the predetermined surface by direct plating so as to cover the exposed portion. An outer edge of the external electrode is spaced away from the exposed portion by about 0.8 μm or more.
Public/Granted literature
- US08971015B2 Electronic component Public/Granted day:2015-03-03
Information query
