发明申请
- 专利标题： WIRING BOARD DEVICE, LUMINAIRE, AND MANUFACTURING METHOD OF THE WIRING BOARD DEVICE
- 专利标题（中）： 接线板设备接线板，灯管及其制造方法
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申请号： US13530678申请日： 2012-06-22
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公开(公告)号： US20130250562A1公开(公告)日： 2013-09-26
- 发明人: Hirotaka Tanaka , Kiyoshi Nishimura , Miho Watanabe , Nobuhiko Betsuda , Takuya Honma
- 申请人： Hirotaka Tanaka , Kiyoshi Nishimura , Miho Watanabe , Nobuhiko Betsuda , Takuya Honma
- 申请人地址： JP Kanagawa-ken
- 专利权人： Toshiba Lighting & Technology Corporation
- 当前专利权人： Toshiba Lighting & Technology Corporation
- 当前专利权人地址： JP Kanagawa-ken
- 优先权： JP2012-068333 20120323
- 主分类号： F21V29/00
- IPC分类号： F21V29/00 ; F21L4/02 ; H05K3/00 ; H05K7/20
摘要：
According to one embodiment, a wiring board device is provided in which even if the temperature of a ceramic board becomes high, the influence on a connector can be reduced and the occurrence of defects due to heat can be prevented. The wiring board device includes a common member. The ceramic board and the connector are placed on the common member. A wiring pattern of the ceramic board and the connector are electrically connected by wiring.
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