发明申请
- 专利标题： FLEXIBLE FIBER TO WAFER INTERFACE
- 专利标题（中）： 柔性纤维到波形界面
-
申请号： US13453027申请日： 2012-04-23
-
公开(公告)号： US20130251305A1公开(公告)日： 2013-09-26
- 发明人: Tymon Barwicz , Hidetoshi Numata , Yoichi Taira
- 申请人： Tymon Barwicz , Hidetoshi Numata , Yoichi Taira
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： G02B6/12
- IPC分类号： G02B6/12
摘要：
A fiber to wafer interface system includes an interface device comprising a flexible substrate portion, a flexible cladding portion arranged on the substrate portion, a flexible single-mode waveguide portion arranged on the cladding portion including a substantially optically transparent material, a connector portion engaging a first distal end of the flexible substrate portion, the connector portion operative to engage a portion of an optical fiber ferrule, a wafer portion comprising a single mode waveguide portion arranged on a portion of the wafer, an adhesive disposed between a portion of the single mode waveguide portion of the body portion and the single mode waveguide portion of the wafer portion, the adhesive securing the body portion to the wafer portion.
公开/授权文献
- US08545108B1 Flexible fiber to wafer interface 公开/授权日：2013-10-01
信息查询
