Invention Application
- Patent Title: THERMALLY-CONTROLLED COMPONENT AND THERMAL CONTROL PROCESS
- Patent Title (中): 热控部件和热控制过程
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Application No.: US13690298Application Date: 2012-11-30
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Publication No.: US20130255248A1Publication Date: 2013-10-03
- Inventor: Paul Stephen DIMASCIO , Michael Douglas ARNETT , Rebecca Evelyn HEFNER
- Applicant: GENERAL ELECTRIC COMPANY
- Applicant Address: US NY Schenectady
- Assignee: GENERAL ELECTRIC COMPANY
- Current Assignee: GENERAL ELECTRIC COMPANY
- Current Assignee Address: US NY Schenectady
- Main IPC: F03G7/06
- IPC: F03G7/06

Abstract:
A thermally-controlled component and thermal control process are disclosed. The thermally-controlled component includes thermally-responsive features. The thermally-responsive features are configured to modify a flow path to control temperature variation of the thermally-controlled component. The thermally-responsive features deploy from or retract toward a surface of the thermally-controlled component in response to a predetermined temperature change. The thermal control process includes modifying the flow path in the thermally-controlled component to control temperature variation of the thermally-controlled component and/or cooling a region of the thermally-controlled component through the thermally-responsive features deploying from or retracting toward a surface of the thermally-controlled component.
Public/Granted literature
- US09587632B2 Thermally-controlled component and thermal control process Public/Granted day:2017-03-07
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