- 专利标题: STAGGERED COLUMN SUPERJUNCTION
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申请号: US13900162申请日: 2013-05-22
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公开(公告)号: US20130260522A1公开(公告)日: 2013-10-03
- 发明人: Lingpeng Guan , Madhur Bobde , Anup Bhalla , Hamza Yilmaz
- 申请人: Lingpeng Guan , Madhur Bobde , Anup Bhalla , Hamza Yilmaz
- 主分类号: H01L29/66
- IPC分类号: H01L29/66
摘要:
A staggered column superjunction semiconductor device may include a cell region having one or more device cells. One or more device cells in the cell region include a semiconductor substrate configured to act as a drain and a semiconductor layer formed on the substrate. A first doped column may be formed in the semiconductor layer to a first depth and a second doped column may be formed in the semiconductor layer to a second depth. The first depth is greater than the second depth. The first and second columns are doped with dopants of a same second conductivity type and extend along a portion of a thickness of the semiconductor layer and are separated from each by a portion of the semiconductor layer.
公开/授权文献
- US08900949B2 Staggered column superjunction 公开/授权日:2014-12-02
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