Invention Application
- Patent Title: HIGH METAL TO VESSEL RATIO STENT AND METHOD
- Patent Title (中): 高金属到船舶比例的方法和方法
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Application No.: US13430942Application Date: 2012-03-27
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Publication No.: US20130261728A1Publication Date: 2013-10-03
- Inventor: Keith PERKINS , Samuel Robaina , Jeffery Argentine , Walter Bruszewski , Andrew Kiehl
- Applicant: Keith PERKINS , Samuel Robaina , Jeffery Argentine , Walter Bruszewski , Andrew Kiehl
- Applicant Address: US CA Santa Rosa
- Assignee: Medtronic Vascular, Inc.
- Current Assignee: Medtronic Vascular, Inc.
- Current Assignee Address: US CA Santa Rosa
- Main IPC: A61F2/84
- IPC: A61F2/84 ; A61F2/82

Abstract:
A method includes covering ostai of branch vessels emanating from a main vessel and an aneurysm with a high metal to vessel ratio stent. A metal to vessel ratio of the high metal to vessel ratio stent is sufficiently high to encourage tissue ingrowth around the high metal to vessel ratio stent yet is sufficiently low to ensure perfusion of the branch vessels through the high metal to vessel ratio stent. The ingrowth of tissue provides secure fixation and sealing of the high metal to vessel ratio stent to the main vessel and remodels and essentially eliminates the aneurysm. Further, as the entire high metal to vessel ratio stent is permeably, the high metal to vessel ratio stent is deployed without having to rotationally position the high metal to vessel ratio stent.
Public/Granted literature
- US09005270B2 High metal to vessel ratio stent and method Public/Granted day:2015-04-14
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