Invention Application
- Patent Title: METHOD FOR SELECTIVE LASER SINTERING AND SYSTEM FOR SELECTIVE LASER SINTERING SUITABLE FOR SAID METHOD
- Patent Title (中): 选择性激光烧结方法及选择性激光烧结系统
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Application No.: US13825893Application Date: 2011-09-22
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Publication No.: US20130264750A1Publication Date: 2013-10-10
- Inventor: Oliver Hofacker , Martin Schäfer
- Applicant: Oliver Hofacker , Martin Schäfer
- Applicant Address: DE Muenchen
- Assignee: SIEMENS AKTIENGESELLSCHAFT
- Current Assignee: SIEMENS AKTIENGESELLSCHAFT
- Current Assignee Address: DE Muenchen
- Priority: DE102010041284.8 20100923
- International Application: PCT/EP2011/066516 WO 20110922
- Main IPC: B29C67/04
- IPC: B29C67/04

Abstract:
A method and a device perform selective laser sintering. In the method for laser sintering, energy is applied linearly to a cross-sectional surface of the component to be produced in order to compact the powdery material. In the case of components with cross-sectional surfaces that have a curved contour, the application of energy can be guided in a line-shaped manner following the curved contour so that the contour of the workpiece that develops is continuously replicated. Advantageously, irregularities in the contour, which are caused by the raster predetermined by the laser sintering method, can thus be largely avoided. The device for laser sintering includes a powder delivery unit which can rotate about a rotational axis located in the interior of an annularly closed cross-section of the workpiece to be produced.)
Public/Granted literature
- US09358729B2 Method for selective laser sintering and system for selective laser sintering suitable for said method Public/Granted day:2016-06-07
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