发明申请
- 专利标题： CHIP CARRIER SUPPORT SYSTEMS
- 专利标题（中）： 芯片支持系统
-
申请号： US13977911申请日： 2011-01-20
-
公开(公告)号： US20130277818A1公开(公告)日： 2013-10-24
- 发明人: Chi Hock Goh , Soon Peng Jason Sim , Poh Boon Teo
- 申请人： Chi Hock Goh , Soon Peng Jason Sim , Poh Boon Teo
- 国际申请： PCT/US11/21911 WO 20110120
- 主分类号： H01L23/00
- IPC分类号： H01L23/00
摘要：
In one embodiment, a chip carrier support system includes a chip carrier support structure and a chip carrier. The chip carder forms a complementary fit with the chip carder support structure and includes an integrated circuit and a plurality of leads in communication with the integrated circuit.
信息查询
IPC分类:
