发明申请
US20130277843A1 FLIP CHIP MOUNTED MONOLITHIC MICROWAVE INTEGRATED CIRCUIT (MMIC) STRUCTURE
有权
FLIP芯片安装单片微波集成电路（MMIC）结构
- 专利标题： FLIP CHIP MOUNTED MONOLITHIC MICROWAVE INTEGRATED CIRCUIT (MMIC) STRUCTURE
- 专利标题（中）： FLIP芯片安装单片微波集成电路（MMIC）结构
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申请号： US13452114申请日： 2012-04-20
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公开(公告)号： US20130277843A1公开(公告)日： 2013-10-24
- 发明人: James A. Robbins , William J. Davis , Robert B. Hallock
- 申请人： James A. Robbins , William J. Davis , Robert B. Hallock
- 申请人地址： US MA Waltham
- 专利权人： Raytheon Company
- 当前专利权人： Raytheon Company
- 当前专利权人地址： US MA Waltham
- 主分类号： H01L23/52
- IPC分类号： H01L23/52
摘要：
A MMIC flip chip mounted to a circuit board having an underfill material disposed between the MMIC and the circuit board and a barrier structure for preventing the underfill material from being disposed under an electronic device of the MMIC while providing a cavity under the electronic device.
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