发明申请
- 专利标题: QFN Package and Manufacturing Process Thereof
- 专利标题(中): QFN封装及制造工艺
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申请号: US13918518申请日: 2013-06-14
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公开(公告)号: US20130280865A1公开(公告)日: 2013-10-24
- 发明人: Geng-Shin SHEN
- 申请人: CHIPMOS TECHNOLOGIES INC.
- 主分类号: H01L23/00
- IPC分类号: H01L23/00
摘要:
The present invention provides a Quad Flat Non-leaded (QPN) package, which comprises a chip, a lead frame, a plurality of composite bumps and an encapsulant. The chip has a plurality of pads, and the lead frame has a plurality of leads. Each of the plurality of composite bumps has a first conductive layer and a second conductive layer. The first conductive layer is electrically connected between one of the pads and the second conductive layer, and the second conductive layer is electrically connected between the first conductive layer and one of the leads. The encapsulant encapsulates the chip, the leads and the composite bumps. Thereby, a QFN package with composite bumps and a semi-cured encapsulant is forming between the spaces of leads of lead frame before chip bonded to the lead frame are provided.
公开/授权文献
- US08962395B2 QFN package and manufacturing process thereof 公开/授权日:2015-02-24