发明申请
- 专利标题： ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM COMPRISING THE SAME
- 专利标题（中）： 用于半导体和粘合膜的粘合组合物
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申请号： US13924877申请日： 2013-06-24
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公开(公告)号： US20130281559A1公开(公告)日： 2013-10-24
- 发明人: Baek Soung Park , Ki Tae SONG , Dong Seon UH , In Hwan KIM
- 申请人： Baek Soung Park , Ki Tae SONG , Dong Seon UH , In Hwan KIM
- 优先权： KR10-2010-0136069 20101227; KR10-2010-0138351 20101229
- 主分类号： C09J163/00
- IPC分类号： C09J163/00
摘要：
An adhesive composition for a semiconductor has two exothermic peaks between 65° C. and 350° C. and has an area ratio of voids of less than 10%, measured after curing at 150° C. for 10 minutes and then at 150° C. for 30 minutes, and then molding at 175° C. for 60 seconds. A first exothermic peak appears between 65° C. and 185° C. and a second exothermic peak appears between 155° C. and 350° C.