A zipper member has a receiving portion having an insertion hole formed therein and including a locking portion, and an inserting portion having an engaging portion to be inserted into the insertion hole of the receiving portion and engaging with the locking portion to establish a locking state. A filament portion integrally connects the receiving portion to the inserting portion. An IC chip is mounted in a holding portion of the zipper member, the holding portion being formed of a hard material along a portion of the filament portion. An attachment tool includes a runner member on which an assembly of zipper members are placed in parallel at regular intervals to be cuttable. The attachment tool sequentially attaches the zipper members to a target one by one.