Invention Application
- Patent Title: Methods of manufacturing high aspect ratio silver nanowires
- Patent Title (中): 制造高长宽比银纳米线的方法
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Application No.: US13857407Application Date: 2013-04-05
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Publication No.: US20130283974A1Publication Date: 2013-10-31
- Inventor: Jonathan D. Lunn , Andrzej Malek
- Applicant: DOW GLOBAL TECHNOLOGIES LLC
- Applicant Address: US MI Midland
- Assignee: DOW GLOBAL TECHNOLOGIES LLC
- Current Assignee: DOW GLOBAL TECHNOLOGIES LLC
- Current Assignee Address: US MI Midland
- Main IPC: B22F9/24
- IPC: B22F9/24 ; H01B1/02
Abstract:
A process for manufacturing high aspect ratio silver nanowires is provided, wherein the recovered silver nanowires exhibit an average diameter of 25 to 80 nm and an average length of 10 to 100 μm; and, wherein the total glycol concentration is
Public/Granted literature
- US09034075B2 Methods of manufacturing high aspect ratio silver nanowires Public/Granted day:2015-05-19
Information query
