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Invention Application
US20130284967A1 THERMOELECTRIC MATERIAL HAVING REDUCED THERMAL CONDUCTIVITY, AND THERMOELECTRIC DEVICE AND MODULE INCLUDING THE SAME 有权
具有降低热导率的热电材料和热电装置以及包括其的模块

THERMOELECTRIC MATERIAL HAVING REDUCED THERMAL CONDUCTIVITY, AND THERMOELECTRIC DEVICE AND MODULE INCLUDING THE SAME
Abstract:
A thermoelectric material including: a thermoelectric matrix including grains with a composition of Formula 1: (BixSb1-x)a(TeySe1-y)b  Formula 1 wherein 1.8≦a≦2.2, 2.8≦b≦3.2, 0≦x≦1, and 0≦y≦1, and wherein a plurality of dislocations is present along a grain boundary between adjacent grains of the composition of Formula 1.
Abstract(Chinese):

一种热电材料，包括：包含具有式1的组成的晶粒的热电基体：（BixSb1-x）a（TeySe1-y）bFormula 1，其中1.8 @ a @ 2.2,2.8 @ b @ 3.2,0 @ x1和 0 @ y @ 1，并且其中沿着式1的组合物的相邻颗粒之间的晶界存在多个位错。

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