发明申请
- 专利标题： TRANSFERRING SYSTEM AND TRANSFERRING METHOD
- 专利标题（中）： 传输系统和传输方法
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申请号： US13820078申请日： 2011-08-31
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公开(公告)号： US20130285285A1公开(公告)日： 2013-10-31
- 发明人: Tatsuya Shimoda , Mitsunori Kokubo , Yuki Sugiura
- 申请人： Tatsuya Shimoda , Mitsunori Kokubo , Yuki Sugiura
- 申请人地址： JP Chiyoda-ku, Tokyo
- 专利权人： TOSHIBA KIKAI KABUSHIKI KAISHA
- 当前专利权人： TOSHIBA KIKAI KABUSHIKI KAISHA
- 当前专利权人地址： JP Chiyoda-ku, Tokyo
- 优先权： JP2010-195677 20100901
- 国际申请： PCT/JP2011/069752 WO 20110831
- 主分类号： B29C59/02
- IPC分类号： B29C59/02
摘要：
A transfer system (1) for transferring a fine transfer pattern (M1) formed in a mold (M) to a to-be-molded material (D) provided on a substrate (W) includes a positioning device (3) configured to position the substrate (W) relative to the mold (M) and to bond the mold (M) and the substrate (W) together after the positioning, and a transfer device (5) provided separately from the positioning device (3) and configured to receive the mold (M) and the substrate (W) positioned and bonded together by the positioning device (3), and to cure the to-be-molded material (D) while pressing the mold (M) and the substrate (W) thereby to perform transfer.
公开/授权文献
- US09688014B2 Transferring system and transferring method 公开/授权日：2017-06-27