发明申请
- 专利标题： CLAD MATERIAL FOR INSULATING SUBSTRATES
- 专利标题（中）： 绝缘材料绝缘材料
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申请号： US13883800申请日： 2011-10-25
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公开(公告)号： US20130292816A1公开(公告)日： 2013-11-07
- 发明人: Atsushi Otaki , Shigeru Oyama
- 申请人： Atsushi Otaki , Shigeru Oyama
- 申请人地址： JP Minato-ku, Tokyo
- 专利权人： SHOWA DENKO K.K.
- 当前专利权人： SHOWA DENKO K.K.
- 当前专利权人地址： JP Minato-ku, Tokyo
- 优先权： JP2010-249561 20101108
- 国际申请： PCT/JP2011/074519 WO 20111025
- 主分类号： H01L23/373
- IPC分类号： H01L23/373
摘要：
A clad material 1A for insulating substrates is provided with a Ni layer 4 made of Ni or a Ni alloy, a Ti layer 6 made of Ti or a Ti alloy and arranged on one side of the Ni layer, and a first Al layer 7 made of Al or an Al alloy and arranged on one side of the Ti layer 6 that is opposite to a side of the Ti layer 6 on which the Ni layer 4 is arranged. The Ni layer 4 and the Ti layer 6 are joined by clad rolling. A Ni—Ti series superelastic alloy layer 5 formed by alloying at least Ni of constituent elements of the Ni layer 4 and at least Ti of constituent elements of the Ti layer 6 is interposed between the Ni layer 4 and the Ti layer 6. The Ti layer 6 and the first Al layer 7 are joined by clad rolling in an adjoining manner.
公开/授权文献
- US08987895B2 Clad material for insulating substrates 公开/授权日：2015-03-24
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