Climate regulation within a chassis of an electronics enclosure (e.g., a workstation case or a server cabinet) may be achieved through an airflow regulated by at least one climate regulator devices (e.g., a variable-speed fan array) and a plenum configured to direct the airflow at the components of the enclosure. The enclosure may store a set of chassis, each having a dedicated plenum and climate regulator devices. However, this architecture may be less efficient than an architecture wherein adjacently mounted chassis may connect plenums (e.g., directly connecting an exhaust of one plenum with an inlet of the adjacent plenum) to unify the airflow directed through several chassis. Additionally, the chassis may feature a removable portion of the plenum wall that provides access to the plenum, and the climate regulator devices may be mounted on the removable portion, such that detachment enables withdrawal and servicing of the climate regulator devices.