发明申请

ADHESIVE RESIN COMPOSITION AND HOT MELT ADHESIVE OBTAINED THEREFROM
摘要:
Object: To provide adhesive resin compositions improved in heat resistance without deteriorations in adhesive strength and flexibility.Solution: An adhesive resin composition comprises 30 to 98 wt % of an ethylene/vinyl acetate copolymer (a) and 70 to 2 wt % of a propylene resin composition (P) described below (wherein the total of the component (a) and the component (P) is 100 wt %). The propylene resin composition (P) comprises 60 to 0 wt % of a propylene polymer (b) having a melting point of 120 to 170° C. and a melt flow rate of 0.1 to 500 g/10 min, and 40 to 100 wt % of a propylene polymer (c) having a melting point of less than 120° C. or showing no melting points and having a melt flow rate of 0.1 to 500 g/10 min (wherein the total of the component (b) and the component (c) is 100 wt %).
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