This disclosure relates to a semiconductor device including resistor arrangement including a first resistor electrically connected to a ground voltage and a second resistor in direct physical contact with the first resistor. The second resistor is configured to receive a temperature independent current and the second resistor has thermal properties similar to those of the first resistor. This disclosure also relates to a semiconductor device including a load configured to receive an operating voltage and a voltage source configured to supply the operating voltage. The semiconductor device further includes a resistor arrangement between the load and the voltage source. This disclosure also relates to a method of using a resistor arrangement to calculate an operating current.