Invention Application
- Patent Title: METHOD OF FABRICATING TOUCH PANEL
- Patent Title (中): 制作面板的方法
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Application No.: US13956381Application Date: 2013-08-01
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Publication No.: US20130312253A1Publication Date: 2013-11-28
- Inventor: Yu-Feng Chien , Zeng-De Chen , Tun-Chun Yang , Seok-Lyul Lee
- Applicant: Au Optronics Corporation
- Applicant Address: TW Hsinchu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsinchu
- Priority: TW99132435 20100924
- Main IPC: G06F3/041
- IPC: G06F3/041

Abstract:
A method of fabricating a touch panel is provided. A substrate having a touch-sensing region and a peripheral region is provided. A touch-sensing circuit layer including first sensing series, and second meshed metal sensing pads is formed on the touch-sensing region of the substrate. An insulating layer having first contact windows is formed on the substrate to cover the touch-sensing circuit layer. The first contact windows expose a portion of the second meshed metal sensing pads. A plurality of second transparent bridge lines are formed on the insulating layer located in the touch-sensing region. Each second transparent bridge line is electrically connected to two adjacent second meshed metal sensing pads through two first contact windows. The second transparent bridge lines completely cover the portion of the second meshed metal sensing pads exposed by the first contact windows.
Public/Granted literature
- US08763237B2 Method of fabricating touch panel Public/Granted day:2014-07-01
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