Invention Application
- Patent Title: PRINTED CIRCUIT BOARDS
- Patent Title (中): 印刷电路板
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Application No.: US13478465Application Date: 2012-05-23
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Publication No.: US20130313013A1Publication Date: 2013-11-28
- Inventor: DAVID SALA PORTA , David Soriano Fosas , Juan Luis López Rodriguez
- Applicant: DAVID SALA PORTA , David Soriano Fosas , Juan Luis López Rodriguez
- Main IPC: H05K1/02
- IPC: H05K1/02

Abstract:
A printed circuit board comprises at least one microstrip transmission line with a conductive solid reference plane and at least one conductive trace embedded in a dielectric substrate, and further comprises at least one conductive shielding layer having a lattice structure, wherein the conductive trace is arranged between the solid reference plane and the shielding layer.
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