发明申请
US20130320463A1 PACKAGE STRUCTURE HAVING MEMS ELEMENT AND FABRICATION METHOD THEREOF
审中-公开
具有MEMS元件的包装结构及其制造方法
- 专利标题： PACKAGE STRUCTURE HAVING MEMS ELEMENT AND FABRICATION METHOD THEREOF
- 专利标题（中）： 具有MEMS元件的包装结构及其制造方法
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申请号： US13588113申请日： 2012-08-17
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公开(公告)号： US20130320463A1公开(公告)日： 2013-12-05
- 发明人: Hong-Da Chang , Cheng-Hsiang Liu , Kuang-Wei Huang , Chun-Hung Lin , Hsin-Yi Liao
- 申请人： Hong-Da Chang , Cheng-Hsiang Liu , Kuang-Wei Huang , Chun-Hung Lin , Hsin-Yi Liao
- 申请人地址： TW Taichung Hsien
- 专利权人： SILICONWARE PRECISION INDUSTRIES CO., LTD.
- 当前专利权人： SILICONWARE PRECISION INDUSTRIES CO., LTD.
- 当前专利权人地址： TW Taichung Hsien
- 优先权： TW101119074 20120529
- 主分类号： H01L29/84
- IPC分类号： H01L29/84 ; H01L21/60
摘要：
A package structure includes: a substrate having a plurality of first conductive pads and a plurality of second conductive pads; an MEMS element disposed on the substrate; a cover member disposed on the MEMS element and having a metal layer formed thereon; a plurality of bonding wires electrically connected to the MEMS element and the second conductive pads of the substrate; a plurality of first wire segments, each having one end electrically connected to a corresponding one of the first conductive pads; and an encapsulant formed on the substrate and encapsulating the MEMS element, the cover member, the first wire segments and the bonding wires, wherein the other end of each of the first wire segments is exposed from the encapsulant. Compared with the prior art, the package structure of the present invention has improved overall yield and functionality.
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