发明申请
US20130320554A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF 有权
半导体器件及其制造方法

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
摘要:
A semiconductor device includes a substrate having a top surface. A semiconductor circuit defines a circuit area on the top surface of the substrate. An interconnect is spaced apart from the circuit area and extends from the top surface into the substrate. The interconnect includes a sidewall formed of an electrically insulating material. An opening is provided in the sidewall.
公开/授权文献
信息查询
0/0