An electronic device having a heat-dissipating structure includes a housing, a printed circuit board, a heat-dissipating element, and a thermal conductive element. The housing has an opening and internally defines a receiving space. The printed circuit board is located in the receiving space and has an electronic component mounted thereon. The heat-dissipating element has a first surface and an opposing second surface, and is disposed above the printed circuit board to locate in the receiving space of the housing wile the first surface is exposed from the housing via the opening. The thermal conductive element is disposed between the heat-dissipating element and the electronic component for transferring heat generated by the electronic component to the heat-dissipating element, so that the heat is directly dissipated into ambient air via the opening. Accordingly, heat produced by the electronic component can be efficiently removed without accumulating in the electronic device.